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Gap Pad® VO Soft


PRODUCT DESCRIPTION：
Highly Conformable,Thermally Conductive Material for Filling Air Gaps
FEATURES AND BENEFITS:
Thermal conductivity: 0.8 W/m-K

Conformable, low hardness

Enhanced puncture, shear and tear resistance

Electrically isolating
TYPICAL PROERTIES OF GAP-PAD VO SOFT:
Color: Mauve/Pink
Reinforcement Carrier: Sil-Pad
Thickness (inch) / (mm): 20mil 40mil 60mil 80mil 100mil 125mil 160mil 200mil
Density (Bulk Rubber) (g/cc):1.6
Hardness (Bulk Rubber) (Shore 00) (1):25
Continuous Use Temp (°F) / (°C):-60℃~200℃
Dielectric Breakdown Voltage (Vac)：＞6000
Dielectric Constant (1000 Hz)：5.5
Volume Resistivity (Ohm-meter)：1011
Flame Rating：V-O
Thermal Conductivity (W/m-K)：0.8
Material advantages:
Gap Pad® VO Soft is recommended for applications that require a minimum amount of pressure on components.

Gap Pad® VO Soft is a highly conformable, low-modulus, filled-silicone polymer on a rubber-coated fiberglass carrier.The material can be used as an interface where one side is in contact with a

leaded device.

TYPICAL APPLICATIONS INCLUDE
Telecommunications

Computer and peripherals

Power conversion

Between heat-generating semiconductors or magnetic components and a heat sink

Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
CONFIGURATIONS AVAILABLE
Sheet form and die-cut parts