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汉高JM7000导电胶,津南半导体材料汉高ABLESTIKJM7000导电胶

更新时间1:2024-04-29 13:51:30 信息编号:da3a9u5tg2689f 举报维权
汉高JM7000导电胶,津南半导体材料汉高ABLESTIKJM7000导电胶
汉高JM7000导电胶,津南半导体材料汉高ABLESTIKJM7000导电胶
汉高JM7000导电胶,津南半导体材料汉高ABLESTIKJM7000导电胶
汉高JM7000导电胶,津南半导体材料汉高ABLESTIKJM7000导电胶
供应商 北京汐源科技有限公司 店铺
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报价 面议
关键词 汉高ABLESTIKJM7000导电胶
所在地 北京建国路15号院
徐发杰
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8年

产品详细介绍

LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.

TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, HAAKE RV-20 Rotoviscometer, mPa·s (cP):
Cone 1º @ Shear rate 22 s
-1 9,000
Work Life @ 25°C, hours 8 to 16
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 150°C
Suggested temperature cures are from 150 to 350ºC. For
applications requiring higher electrical conductivity, a cure cycle of 15
minutes @ 300ºC is recommended. Product properties will not be
reduced by subsequent post die attach thermal exposure, i.e.,
wirebond, and/or lid seal up to 370ºC.

TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150ºC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300ºC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300ºC
Chip Size: ROC
15 x 15 mm > 5

所属分类:胶粘剂/导电银胶

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